"Get ready for some big changes in the 'silicon' of Silicon Valley," writes tech CEO Narbeh Derhacobian who argues that the need to build tens of billions of connected sensor devices will change the way computers get built. "Just like smartphone owners like to pick and choose which apps they want, IoT manufacturers may want to shop for components individually without being locked into a single fab." An anonymous reader summarizes his article on TechCrunch:
Thousands of different hardware devices, each selling around one million units, "would suggest the need for a much greater diversity of chip configurations than we've seen to date." Currently smartphones are engineered using a "System on a Chip" design where all the components are "locked into a single manufacturing process," but Derhacobian predicts chip manufacturers will continue a trend of moving towards a "System in a Package" approach -- "packing components closely together, without the complete, end-to-end integration... In a smart, connected world, sensor requirements could vary greatly from factory to factory, not to mention between industries as varied as agriculture, urban planning and automotive."
"In some ways, the great trends of the PC and smartphone eras were toward standardization of devices. Apple's great vision was understanding that people prefer a beautiful, integrated package, and don't need many choices in hardware. But in software it's generally the opposite. People have different needs, and want to select the apps and programs that work best for them."
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